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Exhibition Floor Plan

Exhibition Booths

Booth Allocation:



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Booths Taken Dated July 10, 2008:

Booth Status
Booth 1 & 2 Hitachi Communication Technologies, Ltd(Platinum)
Booth 3 Tellabs Asia Pacific Pte Ltd
Booth 4 Packetfront Sweden AB / CME Asia Sdn Bhd
Booth 5 Kabel-x Vermarktungs Gmbh
Booth 7 Fiber Duct
Booth 8 Hien Electric Industries Ltd
Booth 9 EXFO
Booth 10 Corning Cable Systems (Silver)
Booth 11 Nexans (Gold)
Booth 12 Sumitomo Electric Industries, Ltd (Gold)
Booth 13 LS Cable
Booth 16 Fira Photonics Co. Ltd
Booth 17 Kumpulan Abex Sdn Bhd
Booth 19 FTTH Asia Council
Booth 20 & 21 Ericsson (M) Sdn Bhd(Platinum)
Booth 22 3M Company (Silver)
Booth 23 Senko Advanced Components (Aus) Pty Ltd(Silver)
Booth 26 Acterna Hong Kong Ltd- JDSU (Gold)
Booth 27 Pearl Holiday (Tour Agent)
Booth 28 TeraSpan Networks Inc.
Booth 30 ADC (Silver)
Booth 32 & 33 Emtelle Asia Pacific (M) Sdn Bhd(Platinum)
Booth 34 Mitsubishi Electric Corporation, communication networks center (Silver)
Booth 35 Plumettaz project Equipment ( Shanghai ) Ltd (Silver)
Booth 36 The Furukawa Electric Co.Ltd ( Silver)
Booth 37 PCOM Pacific Sdn Bhd/ Fujikura Ltd
Booth 38 MIP Equipment Sdn Bhd
Booth 39 Huber+Suhner (Malaysia) Sdn Bhd
Booth 40 MARAIS
Booth 41 Dura-Line India Pvt, Ltd
Booth 42 Alcatel-Lucent (Gold)


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